Ericsson, TI to co-develop innovative 3G solutions for handset manufacturers

Ericsson, one of the world’s leading telecom suppliers, and Texas Instruments Inc. (TI), one of the global leaders in silicon solutions for wireless communications, have forged a strategic technology partnership to develop custom solutions for new Open OS-enabled 3G devices.

Solutions from technologies created by the two companies will combine small and power-efficient 3G modems from Ericsson Mobile Platforms with high-performance OMAP applications processors from TI.

Solutions from the joint engagement will include OMAP, custom basebands and connectivity technologies, and will be capable of supporting the major Open OS, which offers easy access to a rich array of applications and services.

The result of this joint effort will enable all device manufacturers to offer advanced Open OS handsets for both the high-end and the rapidly growing mid-range markets.

The collaboration between Ericsson and TI will enable handset manufacturers to deliver the exciting mobile entertainment and multimedia experiences that consumers around the world are increasingly demanding.

Ericsson’s access technology leadership, current HSPA-enabled platforms, and future HSPA evolution and LTE technologies, combined with the cutting-edge multimedia performance enabled by TI’s OMAP 2, OMAP 3 and future generations of OMAP processors, will continue to push the performance boundaries of mobile devices and mobile entertainment features.

By leveraging TI’s OMAP platform with Open OS support for Windows Mobile, Symbian S60, Symbian UIQ and Linux, these solutions will provide original equipment manufacturers (OEMs) and operators with a robust and flexible architecture for application and service deployment, enabling easier delivery and management of services and content.

This will also enable handset manufacturers and mobile operators to differentiate their products through rich, easy-to-use and customizable user interfaces, and through a robust and flexible application architecture.

The result of the joint effort will bring to market an evolving portfolio of wireless technology platforms with Open OS support to reduce complexity, investment and time-to-market for device manufacturers.